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NTB5405N, NVB5405N
Power MOSFET
40 V, 116 A, Single N ? Channel, D 2 PAK
Features
? Low R DS(on)
? High Current Capability
? Low Gate Charge
? AEC ? Q101 Qualified and PPAP Capable ? NVB5405N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Electronic Brake Systems
? Electronic Power Steering
? Bridge Circuits
V (BR)DSS
40 V
http://onsemi.com
R DS(ON) TYP
4.9 m Ω @ 10 V
N ? Channel
D
I D MAX
(Note 1)
116 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Symbol
V DSS
V GS
Value
40
± 20
Unit
V
V
G
S
Continuous Drain
Current ? R q JC
Power Dissipation ?
R q JC
Continuous Drain
Current ? R q JA (Note 1)
Power Dissipation ?
R q JA (Note 1)
Steady
State
Steady
State
Steady
State
Steady
State
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C
I D
P D
I D
I D
P D
116
82
150
16.5
11.6
3.0
A
W
A
W
1
2
3
D 2 PAK
CASE 418B
STYLE 2
MARKING
DIAGRAM
NTB5405NG
AYWW
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode) Pulsed
Single Pulse Drain ? to Source Avalanche
Energy ? (V DD = 50 V, V GS = 10 V, I PK = 40 A,
L = 1 mH, R G = 25 W )
I DM
T J ,
T STG
I S
EAS
280
? 55 to
175
75
800
A
° C
A
mJ
NTB5405N
G
A
Y
WW
1
= Specific Device Code
= Pb ? Free Device
= Assembly Location
= Year
= Work Week
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T L
260
° C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Device
NTB5405NG
NTB5405NT4G
Package
D 2 PAK
(Pb ? Free)
D 2 PAK
Shipping ?
50 Units / Rail
800 / Tape & Reel
Parameter
Junction ? to ? Case (Drain)
Symbol
R θ JC
Max
1.0
Unit
° C/W
NVB5405NT4G
(Pb ? Free)
D 2 PAK
(Pb ? Free)
800 / Tape & Reel
Junction ? to ? Ambient (Note 1) R θ JA
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 5
50
1
° C/W
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTB5405N/D
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